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  1. 齐乐娱乐老虎机官网 >  解决方案 >  [齐乐娱乐老虎机官网] ST STM32H745I 32位ARM MCU开发方案

[齐乐娱乐老虎机官网] ST STM32H745I 32位ARM MCU开发方案

关键词:ARM Cortex-M7 MCU ARM Cortex-M4 MCU 马达驱动 医疗电子 物联网(IoT) 可穿戴 时间:2019-06-28 11:19:15       来源:齐乐娱乐老虎机官网

ST公司的STM32H745xI/G是基于高性能的Arm® Cortex®-M7和Cortex®-M4 32位RISC核的微控制器,Arm® Cortex®-M7核工作频率高达480MHz,而Arm®Cortex®-M4核工作高达240MHz.两个核具有浮点单元(FPU),支持ARM 单和双精度(Cortex®-M7核)运行和转换(IEEE 754兼容),包括全套DSP指令和存储器保护单元(MPU),以增强应用安全性.STM32H745xI/G器件嵌入高速存储器,具有闪存高达2MB,高达1MB RAM(包括192KB TCM RAM,高达864KB用户SRAM和4KB 备份SRAM),以及连接到APB总线,AHB总线,2x32位多个AHB总线矩阵的各种增强I/O和外设,和一个支持内部和外部存储器接入的多层AXI互连.所有器件提供三个ADC,两个DAC,两个超低功耗比较器,一个低功耗RTC,一个高分辨率计时器,12个通用16位计时器,两个用于马达控制的PWM计时器,5个低功耗计时器和一个真正随机号码发生器(RNG).器件还支持用于外部sigma-delta调制器(DFSDM)的四个数字滤波器,同时还有标准和高档通信接口.主要用在马达驱动和应用控制,医疗设备,工业应用如PLC,逆变器和电路中断器,打印机,扫描仪,告警系统,视频互连和HVAC,以及家庭音频设备,移动应用和物联网(IoT)以及可穿戴设备如智能手表.本文介绍了STM32H745xI/G主要特性,框图,电源方案框图,开关电源(SMPS)降压转换器外接元件图以及开发和评估板STM32H745I-DISCO和STM32H750B-DK主要特性,电路图,材料清单和 PCB设计图.

STM32H745xI/G devices are based on the high-performance Arm® Cortex®-M7 and Cortex®-M4 32-bit RISC cores. The Cortex®-M7 core operates at up to 480 MHz and the Cortex®-M4 core at up to 240 MHz. Both cores feature a floating point unit (FPU) which supports Arm® single- and double-precision (Cortex®-M7 core) operations and conversions (IEEE 754 compliant), including a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.

STM32H745xI/G devices incorporate high-speed embedded memories with a dual-bank Flash memory of up to 2 Mbytes, up to 1 Mbyte of RAM (including 192 Kbytes of TCM RAM, up to 864 Kbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, 2x32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access.

All the devices offer three ADCs, two DACs, two ultra-low power comparators, a low-power RTC, a high-resolution timer, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG). The devices support four digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

• Standard peripherals
– Four I2Cs
– Four USARTs, four UARTs and one LPUART
– Six SPIs, three I2Ss in Half-duplex mode.To achieve audio class accuracy, the I2S peripherals can be clocked by a dedicated internal audio PLL or by an external clock to allow synchronization.
– Four SAI serial audio interfaces
– One SPDIFRX interface
– One SWPMI (Single Wire Protocol Master Interface)
– Management Data Input/Output (MDIO) slaves
– Two SDMMC interfaces
– A USB OTG full-speed and a USB OTG high-speed interface with full-speed capability (with the ULPI) – One FDCAN plus one TT-FDCAN interface
– An Ethernet interface
– Chrom-ART Accelerator™
– HDMI-CEC
• Advanced peripherals including
– A flexible memory control (FMC) interface
– A Quad-SPI Flash memory interface
– A camera interface for CMOS sensors
– An LCD-TFT display controller
– A JPEG hardware compressor/decompressor
STM32H745xI/G devices operate in the –40 to +85℃ temperature range from a 1.62 to 3.6 V power supply. The supply voltage can drop down to 1.62 V by using an external power supervisor and connecting the PDR_ON pin to VSS. Otherwise the supply voltage must stay above 1.71 V with the embedded power voltage detector enabled.
Dedicated supply inputs for USB (OTG_FS and OTG_HS) are available on all packages to allow a greater power supply choice.
A comprehensive set of power-saving modes allows the design of low-power applications.
STM32H745xI/G devices are offered in 5 packages ranging from 144 pins to 240 pins/balls. The set of included peripherals changes with the device chosen.
These features make STM32H745xI/G microcontrollers suitable for a wide range of applications:
• Motor drive and application control
• Medical equipment
• Industrial applications: PLC, inverters, circuit breakers
• Printers, and scanners
• Alarm systems, video intercom, and HVAC
• Home audio appliances
• Mobile applications, Internet of Things
• Wearable devices: smart watches.

STM32H745II主要特性:

Dual core
• 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache; frequency up to 480 MHz, MPU, 1027 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
• 32-bit Arm® 32-bit Cortex®-M4 core with FPU, Adaptive real-time accelerator (ART Accelerator™) for internal Flash memory and external memories, frequency up to 240 MHz, MPU, 300 DMIPS/1.25 DMIPS /MHz (Dhrystone 2.1), and DSP instructions
Memories
• Up to 2 Mbytes of Flash memory with read-while-write support
• 1 Mbyte of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 864 Kbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
• Dual mode Quad-SPI memory interface running up to 133 MHz
• Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND Flash memory clocked up to 125 MHz in Synchronous mode
• CRC calculation unit
Security
• ROP, PC-ROP, active tamper
General-purpose input/outputs
• Up to 168 I/O ports with interrupt capability
Reset and power management
• 3 separate power domains which can be independently clock-gated or switched off:
– D1: high-performance capabilities
– D2: communication peripherals and timers
– D3: reset/clock control/power management
• 1.62 to 3.6 V application supply and I/Os
• POR, PDR, PVD and BOR
• Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs
• Embedded regulator (LDO) to supply the digital circuitry
• High power-efficiency SMPS step-down converter regulator to directly supply VCORE and/or external circuitry
• Voltage scaling in Run and Stop mode (6 configurable ranges)
• Backup regulator (~0.9 V)
• Voltage reference for analog peripheral/VREF+
• 1.2 to 3.6 V VBAT supply
• Low-power modes: Sleep, Stop, Standby and VBAT supporting battery charging
Low-power consumption
• VBAT battery operating mode with charging capability
• CPU and domain power state monitoring pins
• 2.95 μA in Standby mode (Backup SRAM OFF, RTC/LSE ON)
Clock management
• Internal oscillators: 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI
• External oscillators: 4-48 MHz HSE, 32.768 kHz LSE
• 3× PLLs (1 for the system clock, 2 for kernel clocks) with Fractional mode
Interconnect matrix
• 3 bus matrices (1 AXI and 2 AHB)
• Bridges (5× AHB2-APB, 2× AXI2-AHB)
4 DMA controllers to unload the CPU
• 1× high-speed master direct memory access controller (MDMA) with linked list support
• 2× dual-port DMAs with FIFO
• 1× basic DMA with request router capabilities
Up to 35 communication peripherals
• 4× I2Cs FM+ interfaces (SMBus/PMBus)
• 4× USARTs/4x UARTs (ISO7816 interface, LIN, IrDA, up to 12.5 Mbit/s) and 1x LPUART
• 6× SPIs, 3 with muxed duplex I2S audio class accuracy via internal audio PLL or external clock, 1x I2S in LP domain (up to 150 MHz)
• 4x SAIs (serial audio interface)
• SPDIFRX interface
• SWPMI single-wire protocol master I/F
• MDIO Slave interface
• 2× SD/SDIO/MMC interfaces (up to 125 MHz)
• 2× CAN controllers: 2 with CAN FD, 1 with time-triggered CAN (TT-CAN)
• 2× USB OTG interfaces (1FS, 1HS/FS) crystal-less solution with LPM and BCD
• Ethernet MAC interface with DMA controller
• HDMI-CEC
• 8- to 14-bit camera interface (up to 80 MHz)
11 analog peripherals
• 3× ADCs with 16-bit max. resolution (up to 36 channels, up to 3.6 MSPS)
• 1× temperature sensor
• 2× 12-bit D/A converters (1 MHz)
• 2× ultra-low-power comparators
• 2× operational amplifiers (7.3 MHz bandwidth)
• 1× digital filters for sigma delta modulator (DFSDM) with 8 channels/4 filters Graphics
• LCD-TFT controller up to XGA resolution
• Chrom-ART graphical hardware Accelerator™ (DMA2D) to reduce CPU load
• Hardware JPEG Codec
Up to 22 timers and watchdogs
• 1× high-resolution timer (2.1 ns max resolution)
• 2× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input (up to 240 MHz)
• 2× 16-bit advanced motor control timers (up to 240 MHz)
• 10× 16-bit general-purpose timers (up to 240 MHz)
• 5× 16-bit low-power timers (up to 240 MHz)
• 4× watchdogs (independent and window)
• 2× SysTick timers
• RTC with sub-second accuracy and hardware calendar
Debug mode
• SWD & JTAG interfaces
• 4-Kbyte Embedded Trace Buffer
True random number generators (3 oscillators each)
96-bit unique ID
Optional support of extended temperature range up to 125 ℃ (specific part numbers)
All packages are ECOPACK®2 compliant

图1.STM32H745xI/G框图

图2.STM32H745xI/G电源方案框图

图3.开关电源(SMPS)降压转换器外接元件图

开发和评估板STM32H745I-DISCO和STM32H750B-DK

Discovery kits with STM32H745XI and STM32H750XB MCUs

The STM32H745I-DISCO and STM32H750B-DK Discovery kits are complete demonstration and developmentplatforms for STMicroelectronics Arm® Cortex®-M7 and -M4 dual-core-based STM32H745XI (STM32H745XIH6order code) and STM32H750XB (STM32H750XBH6 order code) microcontrollers, respectively.

The STM32H745I-DISCO and STM32H750B-DK Discovery kits are used as reference designs for userapplication development before porting to the final product, thus simplifying the application development.

The full range of hardware features available on the board helps users enhance their application development byan evaluation of almost all peripherals (such as USB OTG_FS, Ethernet 10/100Mb, eMMC, USART, SAI AudioDAC stereo with audio jack input and output, MEMS digital microphone, SDRAM, Quad-SPI Flash memory, andRGB interface LCD with capacitive multi-touch panel). Arduino™ Uno V3 connectors provide easy connection toextension shields or daughterboards for specific applications.

STLINK-V3E is integrated into the board, as an embedded in-circuit debugger and programmer for the STM32MCU and the USB Virtual COM port bridge.

The STM32H745I-DISCO and STM32H750B-DK boards come with the STM32CubeH7 MCU package, whichprovides an STM32 comprehensive software HAL library as well as various software examples.

开发和评估板STM32H745I-DISCO和STM32H750B-DK主要特性:

• Arm® Cortex® core-based microcontroller with 2 Mbytes (STM32H745XIH6) or
128 Kbytes (STM32H750XBH6) of Flash memory and 1 Mbyte of RAM, inTFBGA240+25 package
• 4.3”RGB interface LCD with touch panel connector
• Ethernet compliant with IEEE-802.3-2002, and POE
• USB OTG FS with Micro-AB connector
• SAI audio codec
• One ST-MEMS digital microphone
• 2 x 512-Mbit Quad-SPI NOR Flash memory
• 128-Mbit SDRAM
• 4-Gbyte on-board eMMC
• 1 user and reset push-button
•Fanout daughterboard
• 2 x FDCANs
• Board connectors:
– USB FS Micro-AB connectors
– ST-LINK Micro-B USB connector
– USB power Micro-B connector
– Ethernet RJ45
– Stereo headset jack including analog microphone input
– Audio header for external speakers
– TAG-Connect 10-pin footprint
– Arm® Cortex® 10-pin 1.27 mm pitch debug connector over STDC14footprint
– Arduino™ Uno V3 expansion connectors
–STMod+
• Flexible power-supply options:
– STLINK-V3 USB connector, USB FS connector
– 5 V delivered by RJ45 (Power Over Ethernet)
– 5 V delivered by Arduino™ or external connector
– USB charger
– USB power
• On-board STLINK-V3E debugger/programmer with USB re-enumerationcapability: mass storage, Virtual COM port, and debug port
• Support of a wide choice of Integrated Development Environments (IDEs)including IAR™, Keil®, GCC-based IDEs

图4.开发和评估板STM32H745I-DISCO MB1381外形图

图5.开发和评估板STM32H745I-DISCO MB1381电路图(1)

图6.开发和评估板STM32H745I-DISCO MB1381电路图(2)

图7.开发和评估板STM32H745I-DISCO MB1381电路图(3)

图8.开发和评估板STM32H745I-DISCO MB1381电路图(4)

图9.开发和评估板STM32H745I-DISCO MB1381电路图(5)

图10.开发和评估板STM32H745I-DISCO MB1381电路图(6)

图11.开发和评估板STM32H745I-DISCO MB1381电路图(7)

图12.开发和评估板STM32H745I-DISCO MB1381电路图(8)

图13.开发和评估板STM32H745I-DISCO MB1381电路图(9)

图14.开发和评估板STM32H745I-DISCO MB1381电路图(10)

图15.开发和评估板STM32H745I-DISCO MB1381电路图(11)

图16.开发和评估板STM32H745I-DISCO MB1381电路图(12)

图17.开发和评估板STM32H745I-DISCO MB1381电路图(13)

图18.开发和评估板STM32H745I-DISCO MB1381电路图(14)

图19.开发和评估板STM32H745I-DISCO MB1381电路图(15)

图20.开发和评估板STM32H745I-DISCO MB1381电路图(16)

图21.开发和评估板STM32H745I-DISCO MB1381电路图(17)

图22.开发和评估板STM32H745I-DISCO MB1381电路图(18)

图23.开发和评估板STM32H745I-DISCO MB1381 PCB设计图(1)

图24.开发和评估板STM32H745I-DISCO MB1381 PCB设计图(2)
开发和评估板STM32H745I-DISCO材料清单见:
MB1381-H750XB-B01_BOM.xls
MB1381-H745XI-B01_BOM.xls
详情请见:
https://www.st.com/content/st_com/en/products/microcontrollers-microprocessors/stm32-32-bit-arm-cortex-mcus/stm32-high-performance-mcus/stm32h7-series/stm32h745-755/stm32h745ii.html#
https://www.st.com/content/ccc/resource/technical/layouts_and_diagrams/schematic_pack/group0
/77/ee/18/41/de/bc/40/f7/MB1381-H745XI-B01_Schematic/files/MB1381-H745XI-B01_Schematic.pdf/jcr:content/translations/en.MB1381-H745XI-B01_Schematic.pdf

以及https://www.st.com/content/st_com/en/products/evaluation-tools/product-evaluation-tools/mcu-mpu-eval-tools/stm32-mcu-mpu-eval-tools/stm32-discovery-kits/stm32h745i-disco.html#
stm32h745i-disco.pdf
stm32h745ii.pdf
en.MB1381-H745XI-B01_Schematic.pdf

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